CELL CULTIVATION BASE MATERIAL FORMED OF MULTILAYER FILM COMPRISING CONDUCTIVE POLYMER LAYER AND POLYMER LAYER FOR CELL ADHESION
To provide a base material which serves as a foothold for efficiently producing a tissue, especially, a skeletal muscle or a nerve tissue in vitro.SOLUTION: The inventors have found a novel phenomenon in which, when producing a fiber foothold material having a laminated multilayer film or a coaxial...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
13.12.2018
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Subjects | |
Online Access | Get full text |
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Summary: | To provide a base material which serves as a foothold for efficiently producing a tissue, especially, a skeletal muscle or a nerve tissue in vitro.SOLUTION: The inventors have found a novel phenomenon in which, when producing a fiber foothold material having a laminated multilayer film or a coaxial two-layer structure in which a conductive polymer is a core and a biodegradable polymer is a sheath, instead of using a conductive polymer cell having a high conductance and an adhesion polymer and mixing them, a cell does not directly contact the conductive polymer in the fiber, however, on the fiber, a myotube formation efficiency is improved however no voltage is applied. There is provided a base material for cell cultivation formed into a fiber shape, the base material being a multilayer film base material formed of a conductive polymer layer and a cell adhesion layer, especially, the base material being a coaxial multilayer fiber in which, the conductive polymer is included therein and on an outermost layer, the cell adhesion polymer is coaxially laminated.SELECTED DRAWING: Figure 4
【課題】本発明は、組織、特に、骨格筋組織又は神経組織をin vitroで効率的に作製するための足場となる基材等を提供することを課題とする。【解決手段】本発明者らは、高い導電率を誇る導電性ポリマー細胞と接着用ポリマーを用いて、これらを混ぜ合わせるのではなく、積層された多層膜、又は、導電性ポリマーを芯とし生分解性ポリマーを鞘とする同軸二層構造のファイバー足場材料を作製すると、このファイバーでは細胞が導電性ポリマーに直接接触しないにも関わらず、かつ、該ファイバーに、電圧を負荷しないにもかかわらず筋管形成効率が向上するとの新たな現象を見出した。ファイバー形状を有する細胞の培養用の基材であって、導電性ポリマー層と細胞接着用層との多層膜基材、特に、導電性ポリマーを内包し、最外層に前記細胞接着用ポリマーを同軸状に積層した同軸多層ファイバーである基材等が提供される。【選択図】図4 |
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Bibliography: | Application Number: JP20180082903 |