SILICONE-MODIFIED EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

• Main Authors: KAWAMURA NORIFUMI, OSADA MASAKAZU, OTAKE KOHEI
• Format: Patent
• Language: English; Japanese
• Published: 06.12.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a silicone-modified epoxy resin composition excellent in tracking resistance, and a semiconductor device sealed with the resin composition.SOLUTION: A silicone-modified epoxy resin composition contains, as essential components, the following components (A)-(D): (A) a silicone-modified epoxy resin obtained by a hydrosilylation reaction between an alkenyl group-containing epoxy compound and an organopolysiloxane represented by an average composition formula (1) [where each R is independently a C1-10 monovalent hydrocarbon group, a is a positive number of 0.01≤a≤1, b is a positive number of 1≤b≤3, and 1.01≤a+b<4 is satisfied]; (B) a silicone-modified phenolic resin obtained by a hydrosilylation reaction between an alkenyl group-containing phenolic compound and the organopolysiloxane represented by the average composition formula (1); (C) a black pigment; and (D) an inorganic filler (excluding the black pigment (C)).SELECTED DRAWING: None 【課題】耐トラッキング性に優れたシリコーン変性エポキシ樹脂組成物及び該樹脂組成物により封止された半導体装置を提供する。【解決手段】 下記（Ａ）〜（Ｃ）成分、（Ａ）アルケニル基含有エポキシ化合物と下記平均組成式（１）で表されるオルガノポリシロキサンとのヒドロシリル化反応により得られるシリコーン変性エポキシ樹脂〔上記式（１）中、Ｒは、互いに独立の炭素数１〜１０の１価炭化水素基であり、ａは０．０１≦ａ≦１の正数であり、ｂは１≦ｂ≦３の正数であり、１．０１≦ａ＋ｂ＜４である。〕（Ｂ）アルケニル基含有フェノール化合物と上記平均組成式（１）で表されるオルガノポリシロキサンとのヒドロシリル化反応により得られるシリコーン変性フェノール樹脂（Ｃ）黒色顔料（Ｄ）無機充填材（但し、（Ｃ）黒色顔料は除く）を必須成分として含むことを特徴とするシリコーン変性エポキシ樹脂組成物。【選択図】なし