POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE OF THE SAME

• Main Authors: SUDO TAKESHI, UTAZAKI KENICHI
• Format: Patent
• Language: English; Japanese
• Published: 06.12.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

To provide a polyamide resin composition excellent in flowability in melting, moldability and mechanical characteristics of a molded article, and a molded article using the same.SOLUTION: A polyamide resin composition contains a polyamide resin (A) and phyllosilicate (B), where the polyamide resin (A) contains a terminal modified polyamide resin (a), the terminal modified polyamide resin (a) is a resin having a terminal structure represented by the following general formula (I) in the polymer terminal, and a content of the terminal structure represented by the following general formula (I) to the polyamide resin (A) is 1 mass% or more and 20 mass% or less. General formula (I): -X-(R-O)-R, where m represents a range of 2 to 100; Rrepresents a divalent hydrocarbon group having 2 to 10 carbon atoms; Rrepresents a monovalent hydrocarbon group having 1 to 30 carbon atoms; -X- represents -NH-, -N(CH)- or -(C=O)-; and m pieces of Rincluded in general formula (I) may be the same or different.SELECTED DRAWING: None 【課題】本発明は、溶融時の流動性、成形加工性および成形品の機械的特性に優れたポリアミド樹脂組成物、およびそれを用いてなる成形品を提供する。【解決手段】本発明のポリアミド樹脂組成物は、ポリアミド樹脂（Ａ）および層状珪酸塩（Ｂ）を含有するポリアミド樹脂組成物であって、前記のポリアミド樹脂（Ａ）は末端変性ポリアミド樹脂（ａ）を含有し、前記の末端変性ポリアミド樹脂（ａ）が、下記の一般式（Ｉ）で表される末端構造をポリマーの末端に有する樹脂であり、前記のポリアミド樹脂（Ａ）に対する、下記の一般式（Ｉ）で表される末端構造の含有率が１質量％以上２０質量％以下のポリアミド樹脂組成物である。−Ｘ−（Ｒ１−Ｏ）ｍ−Ｒ２（Ｉ）（上記一般式（Ｉ）中、ｍは２〜１００の範囲を表す。Ｒ１は炭素数２〜１０の２価の炭化水素基を、Ｒ２は炭素数１〜３０の１価の炭化水素基をそれぞれ表す。−Ｘ−は−ＮＨ−、−Ｎ（ＣＨ３）−または−（Ｃ＝Ｏ）−を表す。一般式（Ｉ）中に含まれるｍ個のＲ１は、同じでも異なってもよい。）【選択図】 なし