DIE BONDING AGENT

• Main Authors: MUNEMURA SHINICHI, AKEMICHI TAIKI, HOSHIYAMA MASAAKI, HOCCHI TOYOKAZU
• Format: Patent
• Language: English; Japanese
• Published: 29.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a die bonding agent suitable for coating by jet dispense.SOLUTION: The die bonding agent includes a liquid epoxy resin, a curing agent, a curing catalyst having a D90 onset temperature of 95°C or higher in a DSC peak area, and a pre-gelling agent. The pre-gelling agent of 6 to 25 pts.mass is contained for 100 pts.mass of a liquid component in a constituent component. With respect to viscosity after 1 hour at 50°C, the thickening magnification is 3 times or less. The viscosity at 100°C is 60 Pa s or more.SELECTED DRAWING: Figure 1 【課題】ジェットディスペンスによる塗布に好適なダイボンディング剤の提供する。【解決手段】液状エポキシ樹脂、硬化剤、ＤＳＣピークエリアにおけるＤ９０の開始温度が９５℃以上である硬化触媒およびプレゲル化剤を含む。構成成分中の液状成分１００質量部に対して、プレゲル化剤を６〜２５質量部含有し、５０℃１ｈ後における、粘度について、増粘倍率が３倍以下であり、１００℃時の粘度が６０Ｐａ・ｓ以上であるダイボンディング剤。【選択図】図１