COMPONENT SUPPLY DEVICE, SURFACE MOUNTING MACHINE

• Main Author: FUKUDA TAKAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 29.11.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To inhibit cutting defect of a cover tape by means of a cutting blade.SOLUTION: A component supply device 80 includes a body 81 having a tape passage 83, a sending device 90 placed in the body 81, and sending a component supply tape 70 on the tape passage 83 toward a component supply position G, a tape presser 150 placed in the body 81, and pressing the upper surface of the component supply tape 70 transported on the tape passage 83, and a cutting device 170 placed in the tape presser 150, and cutting the part of a cover tape 75 to be stuck to a carrier tape 71 or the inside thereof. The tape passage 83 has a recess 85 for escaping the component housing part 72 of the carrier tape 71, and in the recess 85 of the tape passage 83, a receive member 200 for receiving the lower surface of the carrier tape 71, when cutting the cover tape, is provided.SELECTED DRAWING: Figure 9 【課題】切断刃によるカバーテープの切断不良を抑制する。【解決手段】部品供給装置８０であって、テープ通路８３を有する本体部８１と、前記本体部８１に配置され、前記テープ通路８３上の部品供給テープ７０を部品供給位置Ｇに向けて送出する送出装置９０と、前記本体部８１に配置され、前記テープ通路８３を搬送される前記部品供給テープ７０の上面を抑えるテープ押さえ１５０と、前記テープ押さえ１５０に配置され、カバーテープ７５のうちキャリアテープ７１に対する貼着部又はその内側を切断する切断装置１７０とを備え、前記テープ通路８３は、前記キャリアテープ７１の部品収納部７２を逃がす凹部８５を有し、前記テープ通路８３の前記凹部８５内には、カバーテープの切断時に、前記キャリアテープ７１の下面を受ける受け部材２００が設けられている。【選択図】図９