METHOD FOR MAKING CHEMICAL MECHANICAL POLISHING LAYER HAVING IMPROVED UNIFORMITY

PROBLEM TO BE SOLVED: To provide a method for manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing a substrate such as a semiconductor wafer.SOLUTION: The method for manufacturing a chemical mechanical polishing layer includes: a step of providing a composition of a plur...

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Main Authors ANDREW WANK, DONNA MARIE ALDEN, MARTY W DEGROOT, GEORGE C JACOB, DAVID SHIDNER, QIAN BAINIAN, KANCHARLA-ARUN K REDDY
Format Patent
LanguageEnglish
Japanese
Published 29.11.2018
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide a method for manufacturing a chemical mechanical polishing (CMP polishing) layer for polishing a substrate such as a semiconductor wafer.SOLUTION: The method for manufacturing a chemical mechanical polishing layer includes: a step of providing a composition of a plurality of liquid-filled microelements having a polymeric shell; a step of classifying the composition by centrifugal air classification to remove fine powders and coarse particles to thereby produce liquid-filled microelements having a density of 800 to 1,500 g/liter; and a step of forming the CMP polishing layer by (i) heating the classified liquid-filled microelements to be converted into gas-filled microelements, then mixing the gas-filled microelements with a liquid polymer matrix forming material and casting or molding the resulting mixture to form a polymeric pad matrix, or (ii) mixing the classified liquid-filled microelements directly with the liquid polymer matrix forming material and casting or molding.SELECTED DRAWING: None 【課題】半導体ウェーハなどの基板を研磨するためのケミカルメカニカルポリッシング（ＣＭＰ研磨）層を製造する方法。【解決手段】ポリマーシェルを有する複数の液体充填マイクロエレメントの組成物を提供するステップ、遠心分離風力分級により組成物を分級して微粉及び粗粒子を除去し、密度が８００〜１５００ｇ／リットルの液体充填マイクロエレメントを製造するステップ、及び（ｉ）分級された液体充填マイクロエレメントを加熱することにより気体充填マイクロエレメントに変換し、次いでこれを液体ポリマーマトリックス形成材料と混合し、得られた混合物をキャスティング若しくは成形してポリマーパッドマトリックスを形成すること、又は（ｉｉ）分級された液体充填マイクロエレメントを液体ポリマーマトリックス形成材料と直接混合し、キャスティング若しくは成形することによって、ＣＭＰ研磨層を形成するステップを含む方法を提供する。【選択図】なし
Bibliography:Application Number: JP20180075519