METHOD FOR MANUFACTURING OPTICAL COMPONENT

• Main Author: ICHIKAWA MASATSUGU
• Format: Patent
• Language: English; Japanese
• Published: 22.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To manufacture an optical component having reduced absorption of light from a light-emitting element or the like in a simple and convenient manner.SOLUTION: A method for manufacturing an optical component for an optical semiconductor according to an embodiment comprises the steps of: preparing an assembly in which a first member and a second member 2 are joined to each other through a metal connecting member 3 by directly bonding together a first metal film 3a formed on the translucent first member having at least one of oxygen, fluorine and nitrogen, and a second metal film 3b formed on the translucent or non-translucent second member 2; and applying a laser beam to the connecting member 3 or applying a microwave to the connecting member 3, thereby making a transmittance of the connecting member 3 for light of a predetermined wavelength higher than a transmittance in its original state.SELECTED DRAWING: Figure 2A 【課題】 発光素子等からの光吸収を低減した光学部品を簡便に製造することができる。【解決手段】 一形態に係る光半導体用の光学部品の製造方法は、酸素、フッ素、及び窒素の少なくともいずれか１つを有する透光性の第１部材に形成された第１金属膜３ａと、透光性又は非透光性の第２部材２に形成された第２金属膜３ｂと、を直接貼り合わせることにより、第１部材と第２部材２とが金属からなる接合部材３を介して接合された接合体を準備する工程と、接合部材３にレーザ光を照射する又は接合部材３にマイクロ波を照射することにより、所定の波長の光に対する接合部材３の透過率を元の状態の透過率よりも高くする工程と、を含む。【選択図】 図２Ａ