PRESSURE SENSOR AND METHOD FOR EQUIPPING THE SAME

• Main Author: ARAI HAYATO
• Format: Patent
• Language: English; Japanese
• Published: 22.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a pressure sensor that can suppress the influence of external stress, and a method for equipping the pressure sensor.SOLUTION: The present invention includes: a resin package 14; a pedestal 13 above the resin package 14 with a die-bond region 12 in between; and a pressure sensor element 11 above the pedestal 13 with the die-bond region 12 in between. The pedestal 13 has a route 13a for a pressure medium to go to the pressure sensor element 11, and is made of a material that has a coefficient of linear expansion of 0.5 to 1.5 times that of the resin package 14 and does not have a glass transition point and a melting point in the range of 20 to 200°C.SELECTED DRAWING: Figure 1 【課題】外部応力の影響を抑制することが可能な圧力センサ及びその実装方法を提供する。【解決手段】樹脂パッケージ１４と、樹脂パッケージ１４上にダイボンド樹脂１２を介して設けられた台座１３と、台座１３上にダイボンド樹脂１２を介して設けられた圧力センサ素子１１とを備え、台座１３は、圧力媒体が圧力センサ素子１１に通じる経路１３ａを有し、台座１３は、樹脂パッケージ１４の線膨張係数の０．５倍〜１．５倍の線膨張係数を有する物質で形成され、台座１３は、少なくとも２０〜２００℃の間においてガラス転移点及び融点を持たない物質で形成されている。【選択図】図１