METHOD FOR PRODUCING ADHESIVE POLYARYLETHERKETONE RESIN MATERIAL, AND METHOD FOR BONDING POLYARYLETHERKETONE RESIN MATERIAL AND ADHEREND

PROBLEM TO BE SOLVED: To provide an adhesive polyaryletherketone resin material which thins a thickness of an adhesive layer and can obtain a high adhesive strength when a polyarylether ketone resin material and an adherend are bonded to each other.SOLUTION: A method for producing an adhesive polyar...

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Bibliographic Details
Main Authors SHIMIZU TOMONAO, FUKUTOME KEIJI, TAKITA KYOKO
Format Patent
LanguageEnglish
Japanese
Published 22.11.2018
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive polyaryletherketone resin material which thins a thickness of an adhesive layer and can obtain a high adhesive strength when a polyarylether ketone resin material and an adherend are bonded to each other.SOLUTION: A method for producing an adhesive polyaryletherketone resin material includes applying an adhesive that contains a chemical polymerization initiator and a radical polymerizable monomer and does not substantially contain a polymerization initiator, to a polyaryletherketone resin material, and then irradiating the resin material with light. In the production method, the maximum peak wavelength of the light used in light irradiation is preferably 400 nm to 500 nm.SELECTED DRAWING: None 【課題】本発明は、ポリアリールエーテルケトン樹脂材料と被着体との接着に際し、接着剤層の厚さを薄くし、かつ高い接着強さを得ることを可能とする接着性ポリアリールエーテルケトン樹脂材料を提供することを課題とする。【解決手段】本発明は、ポリアリールエーテルケトン樹脂材料に、化学重合開始剤とラジカル重合性単量体を含有し、光重合開始剤を実質的に含有しない接着剤を塗布した後、光照射を行うことを特徴とする接着性ポリアリールエーテルケトン樹脂材料の製造方法である。本製造方法において、光照射に使用する光の最大ピーク波長が400nm〜500nmであることが好ましい。【選択図】 なし
Bibliography:Application Number: JP20170085653