LIGHT RECEIVING ELEMENT AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a light receiving element (a photodiode) mounted on an optical receiver, and to provide a method of manufacturing the same.SOLUTION: Provided is a semiconductor light receiving element in which a light receiving element includes a substrate provided with a photodiode...

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Bibliographic Details
Main Authors MAEDA YOSHIO, MURAMOTO YOSHIFUMI, NAKAJIMA FUMITO, SANJO HIROAKI
Format Patent
LanguageEnglish
Japanese
Published 15.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a light receiving element (a photodiode) mounted on an optical receiver, and to provide a method of manufacturing the same.SOLUTION: Provided is a semiconductor light receiving element in which a light receiving element includes a substrate provided with a photodiode part, a semiconductor substrate 501b provided with a lens part, and a substrate including a pedestal part. In the semiconductor light receiving element, the pedestal part and an end part on a surface of the semiconductor substrate 501b are in contact with each other, and the lens part is provided in an opening surrounded by the pedestal part.SELECTED DRAWING: Figure 5 【課題】光受信器に搭載される受光素子（フォトダイオード）およびその作製方法を提供する。【解決手段】受光素子は、フォトダイオード部が設けられた基板と、レンズ部が設けられた半導体基板５０１ｂと、台座部を含む基板を含む半導体受光素子において、台座部と、半導体基板５０１ｂの表面上の端部とが接し、台座部に囲まれた開口部内にレンズ部がある。【選択図】図５
Bibliography:Application Number: JP20170082317