SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND INTERFACE UNIT

• Main Authors: INABA YUKI, IKEDA YOSHINARI, SUNAGO TETSUYA, INABA MICHIHIRO, HORI MOTOHITO
• Format: Patent
• Language: English; Japanese
• Published: 15.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To reduce a burden of connection work when connecting a semiconductor device with external equipment.SOLUTION: A semiconductor device comprises: a base plate 100; multiple pairs of semiconductor units 10 and 20 each including a semiconductor chip and a rod-like unit-side control terminal extending to an opposite side of the base plate 100, and disposed in parallel on the base plate 100; and an interface unit 30 including internal wires 92 and 92 connected with the multiple unit-side control terminals extending from the multiple semiconductor units 10 and 20, rod-like control terminals 31, 32, 33 and 34 for external connection connected with the internal wires 92 and 92 and extending outsides at an opposite side of the semiconductor units 10 and 20, and including a box-like housing part 30a that is provided on the multiple semiconductor units 10 and 20.SELECTED DRAWING: Figure 1 【課題】半導体装置と外部機器とを接続する際の接続作業の負担を軽減できる。【解決手段】半導体装置は、ベースプレート１００と、半導体チップ及び半導体チップに接続されベースプレート１００と反対側に延びる棒状のユニット側制御端子をそれぞれ備えてベースプレート１００上に対をなす個数で並列された複数の半導体ユニット１０，２０と、複数の半導体ユニット１０，２０からそれぞれ延びる複数のユニット側制御端子と接続される内部配線９２，９２、及び内部配線９２，９２と接続され半導体ユニット１０，２０と反対側の外部に延びる棒状の外部接続用制御端子３１，３２，３３，３４を有し、複数の半導体ユニット１０，２０の上に設けられた箱状の収納部３０ａを有するインターフェースユニット３０と、を備える。【選択図】図１