MEASUREMENT APPARATUS AND MEASUREMENT METHOD

• Main Authors: SUGIURA TAKAMASA, YOSHIDA HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 15.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To provide a measuring apparatus and a measurement method capable of accurately measuring the position of the peripheral edge of a film formed on a disk-like body.SOLUTION: A measuring apparatus 1 according to the present invention includes an objective lens 22 that condenses a reflected light obtained when an illumination light for illuminating a peripheral region 66 of the top surface 61 of a wafer 60 which is a peripheral region 66 where a peripheral edge 75 of an EBR film 70 formed on the top surface 61 is disposed is reflected by the region 66, a differential interference optical system that polarizes and splits the illumination light and combines the reflected lights, an imaging unit 30 that images the peripheral area 66 by detecting the reflected lights condensed by the objective lens 22, an image processing unit 40 that processes the image captured by the imaging unit 30, and a confocal point optical system that causes the imaging unit 30 to detect the reflected light from the vicinity of the focal point of the objective lens 22 in the peripheral area 66.SELECTED DRAWING: Figure 1 【課題】ディスク状体上に形成された膜の周縁の位置を精度よく測定することができる測定装置及び測定方法を提供する。【解決手段】本発明に係る測定装置１は、ウェハ６０の上面６１の周縁領域６６であって、上面６１上に形成されたＥＢＲ膜７０の周縁７５が配置された周縁領域６６を照明する照明光が、周縁領域６６によって反射した反射光を集光する対物レンズ２２と、照明光を偏光して分割するとともに反射光を合成する微分干渉光学系と、対物レンズ２２により集光した反射光を検出することによって周縁領域６６を撮像する撮像部３０と、撮像部３０が撮像した画像を処理する画像処理部４０と、周縁領域６６における対物レンズ２２の焦点近傍からの反射光を撮像部３０に検出させる共焦点光学系と、を備える。【選択図】図１