LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD

• Main Authors: NARITA MASAYASU, SAEKI SHUICHI
• Format: Patent
• Language: English; Japanese
• Published: 15.11.2018
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CONTROL OR REGULATING SYSTEMS IN GENERAL; CONTROLLING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS; PERFORMING OPERATIONS; PHYSICS; REGULATING; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To allocate efficiently products from materials made of end materials so as not to cause a processing failure.SOLUTION: In a laser processing system for performing laser processing by irradiating a material with laser light, an image of a product to be processed is projected onto a material, and it is determined whether or not a processing position of a product to be processed is appropriate. The projected image is moved and corrected on the material if the processing position of the product to be processed is not appropriate, and processing data is generated after determining the position of the projection image with respect to the material.SELECTED DRAWING: Figure 6 【課題】加工不良が生じないように端材よりなる材料から効率良く製品を割り付ける。【解決手段】レーザ光を材料へ照射してレーザ加工を行うレーザ加工システムにおいて、材料上に、これから加工する製品の画像を投影し、これから加工する製品の加工位置が適切か否かを判断し、これから加工する製品の加工位置が適切でない場合、投影された画像を、材料上で移動して修正し、材料に対して投影画像の位置を確定した後に、加工データを生成する。【選択図】図６