RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND FLEX-RIGID PRINTED WIRING BOARD

• Main Authors: SHINPO TAKASHI, NAKAMURA YOSHIHIKO, FUJISAWA HIROYUKI, YAMAUCHI AKIHIRO
• Format: Patent
• Language: English; Japanese
• Published: 15.11.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide a resin composition capable of forming a prepreg having good moldability and high adhesion to a substrate and causing less powder falling, and capable of forming a cured product having a low coefficient of thermal expansion.SOLUTION: The resin composition contains (A) an epoxy resin, (B) dicyandiamide, (C) a phenoxy resin, (D) a core-shell rubber, and (E) an inorganic filler. The phenoxy resin (C) has a weight-average molecular weight of 30,000 or more. The phenoxy resin (C) has a tensile elongation of 20% or more. The content of the phenoxy resin (C) is 5-30 pts.mass based on 100 pts.mass of the epoxy resin (A). The content of the core-shell rubber (D) is 3-20 pts.mass based on 100 pts.mass of the epoxy resin (A).SELECTED DRAWING: Figure 1 【課題】良好な成型性及び基材への高い密着性を有するとともに、粉落ちの発生が少ないプリプレグ、並びに低い熱膨張率を有する硬化物を形成しうる樹脂組成物を提供する。【解決手段】樹脂組成物は、（Ａ）エポキシ樹脂と、（Ｂ）ジシアンジアミドと、（Ｃ）フェノキシ樹脂と、（Ｄ）コアシェルゴムと、（Ｅ）無機フィラーと、を含有する。（Ｃ）フェノキシ樹脂の重量平均分子量は、３００００以上である。（Ｃ）フェノキシ樹脂の引張り伸び率は、２０％以上である。（Ｃ）フェノキシ樹脂の含有量は、（Ａ）エポキシ樹脂１００質量部に対して５〜３０質量部である。（Ｄ）コアシェルゴムの含有量は、前記（Ａ）エポキシ樹脂１００質量部に対して３〜２０質量部である。【選択図】図１