THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF
SOLUTION: A through electrode substrate includes a transparent substrate 2 that has a first surface 21 and a second surface 22 opposite to the first surface 21 and is provided with a through hole 23 penetrating from the first surface 21 to the second surface 22, a first adhesion layer 31 located on...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
08.11.2018
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | SOLUTION: A through electrode substrate includes a transparent substrate 2 that has a first surface 21 and a second surface 22 opposite to the first surface 21 and is provided with a through hole 23 penetrating from the first surface 21 to the second surface 22, a first adhesion layer 31 located on a side wall 231 of the through hole 23, second adhesion layers 32 and 33 located at least partially on at least one of the first surface 21 and the second surface 22, a through electrode 4 located on the first adhesion layer 31 inside the through hole 23, and conductive layers 51 and 52 located on the second adhesion layers 32 and 33.EFFECT: Separation of a through electrode 4 and conductive layers 51 and 52 from a transparent substrate 2 can be suppressed at the same time.SELECTED DRAWING: Figure 1
【解決手段】第1表面21と、第1表面21の反対側の第2表面22とを有し、第1表面21から第2表面22まで貫通する貫通孔23が設けられた透明基板2と、貫通孔23の側壁231上に位置する第1密着層31と、第1表面21上および第2表面22上の少なくとも一方に少なくとも部分的に位置する第2密着層32、33と、貫通孔23の内部において第1密着層31上に位置する貫通電極4と、第2密着層32、33上に位置する導電層51、52と、を備える。【効果】透明基板2からの貫通電極4と導電層51,52の剥離を同時に抑制できる。【選択図】図1 |
---|---|
AbstractList | SOLUTION: A through electrode substrate includes a transparent substrate 2 that has a first surface 21 and a second surface 22 opposite to the first surface 21 and is provided with a through hole 23 penetrating from the first surface 21 to the second surface 22, a first adhesion layer 31 located on a side wall 231 of the through hole 23, second adhesion layers 32 and 33 located at least partially on at least one of the first surface 21 and the second surface 22, a through electrode 4 located on the first adhesion layer 31 inside the through hole 23, and conductive layers 51 and 52 located on the second adhesion layers 32 and 33.EFFECT: Separation of a through electrode 4 and conductive layers 51 and 52 from a transparent substrate 2 can be suppressed at the same time.SELECTED DRAWING: Figure 1
【解決手段】第1表面21と、第1表面21の反対側の第2表面22とを有し、第1表面21から第2表面22まで貫通する貫通孔23が設けられた透明基板2と、貫通孔23の側壁231上に位置する第1密着層31と、第1表面21上および第2表面22上の少なくとも一方に少なくとも部分的に位置する第2密着層32、33と、貫通孔23の内部において第1密着層31上に位置する貫通電極4と、第2密着層32、33上に位置する導電層51、52と、を備える。【効果】透明基板2からの貫通電極4と導電層51,52の剥離を同時に抑制できる。【選択図】図1 |
Author | FURUSHO HIROKI ARIYOSHI AYAKO CHIGIRA ATSUKO NARITA YUJI |
Author_xml | – fullname: CHIGIRA ATSUKO – fullname: NARITA YUJI – fullname: ARIYOSHI AYAKO – fullname: FURUSHO HIROKI |
BookMark | eNrjYmDJy89L5WSwCfEI8g9191Bw9XF1Dgnyd3FVCA51Cg4JcgxxVXD0c1HwdfQLdXN0DgkN8vRzV_B1DfHwd1EI8XANcvV342FgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGFobmJoaWBo7GRCkCAIgELAE |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 貫通電極基板およびその製造方法 |
ExternalDocumentID | JP2018174190A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JP2018174190A3 |
IEDL.DBID | EVB |
IngestDate | Fri Aug 09 05:01:06 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English Japanese |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JP2018174190A3 |
Notes | Application Number: JP20170070285 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181108&DB=EPODOC&CC=JP&NR=2018174190A |
ParticipantIDs | epo_espacenet_JP2018174190A |
PublicationCentury | 2000 |
PublicationDate | 20181108 |
PublicationDateYYYYMMDD | 2018-11-08 |
PublicationDate_xml | – month: 11 year: 2018 text: 20181108 day: 08 |
PublicationDecade | 2010 |
PublicationYear | 2018 |
RelatedCompanies | DAINIPPON PRINTING CO LTD |
RelatedCompanies_xml | – name: DAINIPPON PRINTING CO LTD |
Score | 3.2969372 |
Snippet | SOLUTION: A through electrode substrate includes a transparent substrate 2 that has a first surface 21 and a second surface 22 opposite to the first surface 21... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20181108&DB=EPODOC&locale=&CC=JP&NR=2018174190A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFPVNp6JOJYj0rZi6j7TgkC5JLcO1paayt5HGDlTYhqv475vGTfe0tyQHx13g8ssl9wFw05USu-28Zbsy97SDQjp2nivXzrF2cCUhxJMmQDbqhll7MOqMavCxyoUxdUK_TXFEbVFK23tpzuv5_yMWM7GVi9v8TS_NHgLRY9bSO9Zw5WDXYv0eT2IWU4vS3iCxovSXptHTw_4WbFf36KrQPn_pV2kp83VMCQ5gJ9HspuUh1N5lA_boqvVaA3aHyx9vPVwa3-II7kWYxtljiPgTpyKNGUfPWb9qeiw48iOGhn6UBT4VWRXhgIZchDFDIuQpj4NjuA64oKGtxRj_KT0eJGsit06gPp1Ni1NACpNCOROvXang4a6npJSFc4eJUpNXh5xBcwOj843UJuxXM5Nq515Avfz8Ki415pb5ldmrH4_Kf4I |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFOebTkWdH0Wkb8XUdUsLDunS1DrXD2oqextJ7UCFbbiK_75p3NSnvYUcHJfA3Y9fch8AV13OkW2JtmFz4UiCgjuGELltCCQJLscYO1wlyEbdILMGo86oBu-rWhjVJ_RLNUeUHpVLfy9VvJ7_PWJ5KrdycS1e5dbszmc9T1-yYwlXJrJ1r9-jSezFRCekN0j0KP2RSfR0kLsBm1hywqrRPn3uV2Up8_-Y4u_CViLVTcs9qL3xJjTIavRaE7bD5Y-3XC6db7EPtyxI4-w-0OiQEpbGHtWesn419JhRzY08LXSjzHcJy6oMBy2kLIg9jQU0pbF_AJc-ZSQwpBnj30OPB8k_k9uHUJ_OpsURaDnCRW5OHEtSActBXSfnnBfmDcJ5Pnkx8TG01ig6WSu9gEbAwuF4-BA9tmCnkqiyO_sU6uXHZ3Em8bcU5-revgGsG4Jt |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=THROUGH+ELECTRODE+SUBSTRATE+AND+MANUFACTURING+METHOD+THEREOF&rft.inventor=CHIGIRA+ATSUKO&rft.inventor=NARITA+YUJI&rft.inventor=ARIYOSHI+AYAKO&rft.inventor=FURUSHO+HIROKI&rft.date=2018-11-08&rft.externalDBID=A&rft.externalDocID=JP2018174190A |