THROUGH ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREOF

• Main Authors: CHIGIRA ATSUKO, NARITA YUJI, ARIYOSHI AYAKO, FURUSHO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 08.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

SOLUTION: A through electrode substrate includes a transparent substrate 2 that has a first surface 21 and a second surface 22 opposite to the first surface 21 and is provided with a through hole 23 penetrating from the first surface 21 to the second surface 22, a first adhesion layer 31 located on a side wall 231 of the through hole 23, second adhesion layers 32 and 33 located at least partially on at least one of the first surface 21 and the second surface 22, a through electrode 4 located on the first adhesion layer 31 inside the through hole 23, and conductive layers 51 and 52 located on the second adhesion layers 32 and 33.EFFECT: Separation of a through electrode 4 and conductive layers 51 and 52 from a transparent substrate 2 can be suppressed at the same time.SELECTED DRAWING: Figure 1 【解決手段】第１表面２１と、第１表面２１の反対側の第２表面２２とを有し、第１表面２１から第２表面２２まで貫通する貫通孔２３が設けられた透明基板２と、貫通孔２３の側壁２３１上に位置する第１密着層３１と、第１表面２１上および第２表面２２上の少なくとも一方に少なくとも部分的に位置する第２密着層３２、３３と、貫通孔２３の内部において第１密着層３１上に位置する貫通電極４と、第２密着層３２、３３上に位置する導電層５１、５２と、を備える。【効果】透明基板２からの貫通電極４と導電層５１，５２の剥離を同時に抑制できる。【選択図】図１