THROUGH-ELECTRODE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

• Main Authors: NARITA YUJI, CHIGIRA ATSUKO, ARIYOSHI AYAKO, FURUSHO HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 08.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide: a through-electrode substrate which allows improvement in reliability of electrical connection between a through-electrode and conducting layers; and a manufacturing method for the through-electrode substrate.SOLUTION: A through-electrode substrate comprises: a transparent substrate 2 which has a first surface 21 and a second surface 22 at an opposite side to the first surface 21, and which is provided with a through-hole 23 penetrating from the first surface 21 to the second surface 22; a first adhesion layer 31 which is located on a lateral wall 231 of the through-hole 23; a through-electrode 4 which is located on the first adhesion layer 31 inside the through-hole 23; and conducting layers 51 and 52 which are located at least partially on at least one of the surfaces 21 and 22, and which are continuous with the through-electrode 4 on one end of the lateral wall 231.SELECTED DRAWING: Figure 1 【課題】貫通電極と導電層との電気的接続の信頼性を向上させることができる貫通電極基板およびその製造方法を提供する。【解決手段】第１表面２１と、第１表面２１の反対側の第２表面２２とを有し、第１表面２１から第２表面２２まで貫通する貫通孔２３が設けられた透明基板２と、貫通孔２３の側壁２３１上に位置する第１密着層３１と、貫通孔２３の内部において第１密着層３１上に位置する貫通電極４と、少なくとも一方の表面２１、２２上に少なくとも部分的に位置し、側壁２３１の一端上において貫通電極４に連続する導電層５１、５２と、を備える。【選択図】図１