POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF

• Main Authors: TAMAI AKIYOSHI, AKITA DAI, UMEZU HIDEYUKI, MORIOKA NOBUHIRO, NISHIDA SHINGO
• Format: Patent
• Language: English; Japanese
• Published: 08.11.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a polyamide resin composition that has a small gas generation amount during molding and in which a molded product excellent in high temperature rigidity and in burst strength at low temperature and high temperature when heat treated at high temperature can be obtained.SOLUTION: Provided is a polyamide resin composition characterized in containing a compound (B) having three or more hydroxyl groups in one molecule in a proportion of 0.1 pts.wt. or more and 20 pts.wt. or less with respect to 100 pts.wt. of a first polyamide resin (A) and containing a second polyamide resin (C) having an amide group concentration smaller than the amide group concentration of the first polyamide resin (A) by 0.8 mmol/g or more in a proportion of 0.05 pts.wt. or more and less than 5 pts.wt.SELECTED DRAWING: None 【課題】成形時のガス発生量が少なく、高温剛性と高温で熱処理された際の低温および高温でのバースト強度に優れる成形品を得ることのできるポリアミド樹脂組成物を提供すること。【解決手段】第一のポリアミド樹脂（Ａ）の１００重量部に対して、１分子中に３つ以上の水酸基を有する化合物（Ｂ）を０．１重量部以上２０重量部以下の割合で含有し、第一のポリアミド樹脂（Ａ）のアミド基濃度よりも０．８ｍｍｏｌ／ｇ以上小さいアミド基濃度を有する第二のポリアミド樹脂（Ｃ）を０．０５重量部以上５重量部未満の割合で含有することを特徴とするポリアミド樹脂組成物。【選択図】なし