MANUFACTURING METHOD OF CONNECTION BODY

• Main Author: TOKUHISA KENJI
• Format: Patent
• Language: English; Japanese
• Published: 01.11.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a manufacturing method of connection body in which excellent conduction resistance can be obtained by improving reaction rate in a light shielding part.SOLUTION: A manufacturing method of connection body has an arrangement step of arranging an anisotropic conductive adhesive, containing an epoxy compound, at least one kind of cationic polymerization compound selected from oxetane compounds, a photo cationic polymerization initiator, a heat cationic polymerization initiator, and conductive particles, on a first electronic component, a light irradiation step of radiating light at least from the anisotropic conductive adhesive side, so that the lowest molten viscosity of the anisotropic conductive adhesive becomes 300-8000 Pa s, and the delivery temperature of the lowest molten viscosity becomes 50-100°C, and a thermo compression bond step of arranging a second electronic component on the anisotropic conductive adhesive, and thermo compression bonding the second electronic component to the first electronic component by means of a thermo compression tool. With such an arrangement, excessive increase of the lowest molten viscosity due to light irradiation ahead is restrained, reaction rate in a light shielding part is improved, and an excellent conduction resistance can be obtained.SELECTED DRAWING: Figure 1 【課題】遮光部における反応率を向上させ、優れた導通抵抗が得られる接続体の製造方法を提供する。【解決手段】エポキシ化合物、オキセタン化合物から選択される少なくとも１種のカチオン重合性化合物と、光カチオン重合開始剤と、熱カチオン重合開始剤と、導電粒子とを含有する異方性導電接着剤を第１の電子部品上に配置する配置工程と、異方性導電接着剤の最低溶融粘度が３００〜８０００Ｐａ・ｓ、最低溶融粘度の到達温度が５０〜１００℃となるように、少なくとも異方性導電接着剤側から光照射する光照射工程と、異方性導電接着剤上に第２の電子部品を配置し、熱圧着ツールにより第２の電子部品を第１の電子部品に熱圧着させる熱圧着工程とを有する。これにより、光の先照射による最低溶融粘度の過度な上昇を抑制し、遮光部の反応率を向上させ、優れた導通抵抗を得ることができる。【選択図】図１