CURABLE SILICONE RESIN COMPOSITION AND CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE USING THEM

• Main Authors: SEKIYA YUKI, OGAWA TAKESHI, KAWAI WATARU, AKIYAMA KATSUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 01.11.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

To provide an addition curable type curable silicone resin composition providing a cured product excellent in heat resistance and a cured product, and a semiconductor device using them.SOLUTION: There are provided a curable silicone resin composition for optical semiconductor sealing which contains at least component (A) that is a silicone resin represented by formula [1], component (B) that is a silicone resin represented by formula [2], and component (C) that is a hydrosilylation catalyst. In the formulae, a, b and d each independently represent more than 0 and less than 1, c is less than 1 including 0, a+b+c+d=1, O in each structural unit is O of a siloxane bond or O forming a silanol group; Rrepresents a monovalent unsaturated hydrocarbon group; e to g are more than 0 and less than 1, e+f+g=1.SELECTED DRAWING: Figure 1 【課題】耐熱性に優れる硬化物を与える付加硬化型の硬化性シリコーン樹脂組成物および硬化物、並びにこれらを用いた半導体装置を提供する。【解決手段】（Ａ）成分は式［１］で示されるシリコーン樹脂、（Ｂ）成分は式［２］で示されるシリコーン樹脂、及び（Ｃ）成分はヒドロシリル化触媒、を少なくとも含む、光半導体封止用硬化性シリコーン樹脂組成物。（ａ、ｂ及びｄは夫々独立に０超、１未満、ｃは０を含む１未満、ａ＋ｂ＋ｃ＋ｄ＝１、各構造単位におけるＯは、シロキサン結合のＯ、又はシラノール基を形成しているＯ；Ｒ１は１価の不飽和炭化水素基；ｅ〜ｇは０超、１未満、ｅ＋ｆ＋ｇ＝１）【選択図】図１