POLISHING PAD

To provide a polishing pad that has improved polishing uniformity and can flatten the surface of a polishing object while suppressing scratches on the polishing object.SOLUTION: A polishing pad has a polyurethane foam sheet that includes a plurality of tear-shaped bubbles formed by wet deposition as...

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Bibliographic Details
Main Authors MATSUOKA RYUMA, SUZUKI MOTOFUMI
Format Patent
LanguageEnglish
Japanese
Published 01.11.2018
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:To provide a polishing pad that has improved polishing uniformity and can flatten the surface of a polishing object while suppressing scratches on the polishing object.SOLUTION: A polishing pad has a polyurethane foam sheet that includes a plurality of tear-shaped bubbles formed by wet deposition as a polishing layer. The polishing layer has fine fibers with a specific surface of 10-500 m/g.SELECTED DRAWING: Figure 1 【課題】 研磨パッドにおいて、被研磨物に対する研磨傷の発生を抑制しながら、被研磨物の表面を平坦化し得る研磨均一性の向上を図ること。【解決手段】 湿式成膜法により形成される複数の涙形発泡を内在するポリウレタン発泡シートを研磨層として有する研磨パッドであって、研磨層が、比表面積１０乃至５００m2/gの微小繊維を含むもの。【選択図】 図１
Bibliography:Application Number: JP20170069360