WIRING BOARD AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a wiring board or the like in which a breaking or the like of a side surface conductor in an inner surface of a castellation is suppressed.SOLUTION: A wiring board 202 includes: an insulation substrate having a first main surface 103 and a second main surface 104 opp...

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Bibliographic Details
Main Author ONIZUKA YOSHITOMO
Format Patent
LanguageEnglish
Japanese
Published 25.10.2018
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Summary:PROBLEM TO BE SOLVED: To provide a wiring board or the like in which a breaking or the like of a side surface conductor in an inner surface of a castellation is suppressed.SOLUTION: A wiring board 202 includes: an insulation substrate having a first main surface 103 and a second main surface 104 opposite to the first main surface 103; a first castellation formed from the first main surface 103 to a side surface; and a side surface conductor 109 adhered to an inner side surface of the first castellation. A part where the side surface conductor 109 is adhered to at least the inner side surface of the first castellation is nipped in an inner side from an end part of the second main surface 104 side to an end part of the first main surface 103 side.SELECTED DRAWING: Figure 1 【課題】 キャスタレーションの内側面における側面導体の断線等が抑制された配線基板等を提供すること。【解決手段】 配線基板202は、第1主面103および第1主面103と相対する第2主面104を有している絶縁基板と、第1主面103から側面にかけて形成された第1キャスタレーションと、第1キャスタレーションの内側面に被着された側面導体109とを有しており、第1キャスタレーションのうち少なくとも内側面に側面導体109が被着された部分は、第2主面104側の端部から第1主面103側の端部にかけて内側に狭まっている。【選択図】 図1
Bibliography:Application Number: JP20180135894