THERMOSETTING RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE

• Main Authors: KANEKO TATSUNORI, SHIRAOKAWA YOSHIKATSU, YANAGIDA MAKOTO, KUSHIDA KEISUKE
• Format: Patent
• Language: English; Japanese
• Published: 25.10.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that has excellent moldability and maintains high adhesiveness to a copper foil, and yet achieves high heat resistance and excellent dielectric properties, and a prepreg, a copper-clad laminate, a printed wiring board and a semiconductor package employing the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains (A) a copolymer resin containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (B) an epoxy modified polybutadiene having hydroxy groups at both molecular terminals, (C) an active ester compound, and (D) at least one selected from the group consisting of a maleimide compound and a modified product thereof. There are also provided a prepreg, a copper-clad laminate, a printed wiring board and a semiconductor package employing the thermosetting resin composition.SELECTED DRAWING: None 【課題】成形性に優れ、銅箔との高接着性を維持しつつ、高耐熱性及び優れた誘電特性を達成し得る熱硬化性樹脂組成物、並びに該熱硬化性樹脂組成物を用いたプリプレグ、銅張積層板、プリント配線板及び半導体パッケージを提供する。【解決手段】（Ａ）芳香族ビニル化合物に由来する構造単位と無水マレイン酸に由来する構造単位とを有する共重合樹脂と、（Ｂ）分子両末端に水酸基を有するエポキシ変性ポリブタジエンと、（Ｃ）活性エステル化合物と、（Ｄ）マレイミド化合物及びその変性物からなる群から選ばれる１種以上と、を含有してなる熱硬化性樹脂組成物、並びに該熱硬化性樹脂組成物を用いたプリプレグ、銅張積層板、プリント配線板及び半導体パッケージである。【選択図】なし