SEMICONDUCTOR LIGHT-EMITTING DEVICE

• Main Authors: KOBUCHI KEIYO, ITAI JUNICHI
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device in which both a base material and an encapsulation resin have a high heat resistance and a high light resistance, and that can achieve long lifetime and increase in output.SOLUTION: A semiconductor light-emitting device includes: a base material 2; an n-side wiring 3 and a p-side wiring 4 formed on the base material 2; a light-emitting element 7 arranged on the base material 2, and electrically connected with the n-side wiring 3 and the p-side wiring 4; and a transparent encapsulation resin 10 that encapsulates the light-emitting element 7. The base material contains an acrylic resin, and the encapsulation resin contains silicone.SELECTED DRAWING: Figure 1 【課題】基材および封止樹脂が共に高耐熱性・高耐光性を有し、高寿命、高出力化を実現することができる半導体発光装置を提供する。【解決手段】基材２と、基材２に形成されたｎ側配線３およびｐ側配線４と、基材２上に配置され、ｎ側配線３およびｐ側配線４に電気的に接続された発光素子７と、発光素子７を封止する透明性の封止樹脂１０とを含み、前記基材が、アクリル系樹脂を含有し、前記封止樹脂がシリコーンを含有している。【選択図】図１