SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of shortening a wiring length between a through electrode and an external terminal.SOLUTION: For a signal SA from the exterior, an external terminal 1 is arranged in a region R1 of an interposer substrate 2. An intermediate terminal 3 i...

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Bibliographic Details
Main Authors KAWASAKI KAZUSHIGE, KOYANAGI MASARU, ITO MIKIHIKO
Format Patent
LanguageEnglish
Japanese
Published 11.10.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device capable of shortening a wiring length between a through electrode and an external terminal.SOLUTION: For a signal SA from the exterior, an external terminal 1 is arranged in a region R1 of an interposer substrate 2. An intermediate terminal 3 is arranged in a region R2 of the interposer substrate 2. An intermediate terminal 4 is arranged in a region R3 of the interposer substrate 2. A through electrode 6B is arranged in a region R4 of the interposer substrate 2.SELECTED DRAWING: Figure 1 【課題】貫通電極と外部端子との間の配線長を短縮することが可能な半導体装置を提供する。【解決手段】外部からの信号ＳＡについて、外部端子１は、インターポーザ基板２の領域Ｒ１に配置し、中間端子３は、インターポーザ基板２の領域Ｒ２に配置し、中間端子４は、インターポーザ基板２の領域Ｒ３に配置し、貫通電極６Ｂは、インターポーザ基板２の領域Ｒ４に配置する。【選択図】図１
Bibliography:Application Number: JP20170055239