DIAMOND-COATED CEMENTED CARBIDE ALLOY CUTTING TOOL

• Main Authors: SHIKADA SHINICHI, TOMINAGA TETSUMITSU, TAKASHIMA HIDEAKI
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2018
• Subjects: BORING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; COMPOUNDS THEREOF; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INORGANIC CHEMISTRY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; MILLING; NON-METALLIC ELEMENTS; PERFORMING OPERATIONS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING; TURNING

PROBLEM TO BE SOLVED: To provide a diamond-coated tool which improves adhesiveness between a diamond film and a tool base and a tip strength, and improves chipping resistance and peeling resistance.SOLUTION: A WC average particle diameter of a WC-based cemented carbide alloy base containing 3-15 mass% of Co is 0.5-0.9 μm, an unevenness maximum height difference of an interface of the base in contact with a diamond film is 0.5-1.0 μm, a distance between the maximum unevennesses of the adjacent bases at the interface is 0.5-1.5 μm, a length in a diamond film thickness direction in a region from which a binder phase is removed is 0.5-2.0 μm, and in WC particles of 70 area% or more in the WC particles in a longitudinal section in contact with the diamond film at the interface, a maximum value (L) of a distance between apexes is 0.4-0.8 μm, a minimum value (L) of a distance between tangent lines of a diameter or a facing surface of an inscribed circle is 0.2-0.4 μm, and (L)/(L) is 1.5 to 2.5.SELECTED DRAWING: Figure 1 【課題】ダイヤモンド皮膜と工具基体との密着性と刃先強度を向上させ、耐チッピング性と耐剥離性が向上したダイヤモンド被覆工具を提供する。【解決手段】Ｃｏを３〜１５質量％含むＷＣ基超硬合金基体のＷＣ平均粒径が０．５〜０．９μｍ、ダイヤモンド皮膜に接する基体の界面の凹凸最大高低差が０．５〜１．０μｍ、界面における隣り合う基体の最大凹凸間距離が０．５〜１．５μｍ、結合相が除去された領域のダイヤモンド皮膜膜厚方向の長さが０．５〜２．０μｍ、界面におけるダイヤモンド皮膜に接する縦断面に占めるＷＣ粒子のうち７０面積％以上のＷＣ粒子において、頂点間距離の最大値（Ｌ１）が０．４〜０．８μｍ、内接する内接円の直径あるいは対向面の接線間の距離の最小値（Ｌ２）が０．２〜０．４μｍであって、（Ｌ１）/（Ｌ2）が１．５〜２．５である。【選択図】図１