DISC SPRING MANUFACTURING METHOD

• Main Authors: OKURA SHINSUKE, TSUJI YUYA, SUZUKI TOSHIKAZU
• Format: Patent
• Language: English; Japanese
• Published: 11.10.2018
• Subjects: BLASTING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; LIGHTING; MACHINE TOOLS; MEANS FOR DAMPING VIBRATION; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SHOCK-ABSORBERS; SOLDERING OR UNSOLDERING; SPRINGS; THERMAL INSULATION IN GENERAL; TRANSPORTING; WEAPONS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To dispose a disc spring manufacturing method which can improve disc spring durability by reducing welding defects remaining at welding points.SOLUTION: A circumferential one end 10A of a strip ring 10 formed in a C shape is butted to the circumferential other end 10B to weld them. For welding, while voltage is being impressed between one end 10A and a contact 10C with the other end 10B to heat the contact 10C, the contact 10C is compressed by pressurization to expand a part of the contact 10C to an outer peripheral side. Next, an expanded part expanded during the welding process is eliminated. This causes most of welding defects occurring upon welding to flow outside with a member constituting the expanded part 10D when the expanded part 10D is produced. Therefore, if the expanded part 10D is eliminated, welding defects remaining at welding points decrease. Consequently, disc durability can improve.SELECTED DRAWING: Figure 4 【課題】 溶接箇所に残存する溶接欠陥を減少させて皿ばねの耐久性を向上させることが可能な皿ばねの製造方法を開示する。【解決手段】 Ｃ字状に形成された帯リング体１０の円周方向一端１０Ａと当該円周方向他端１０Ｂと付き合わせ溶接する。溶接時には、一端１０Ａと他端１０Ｂとの接触部１０Ｃ間に電圧を印加して当該接触部１０Ｃを発熱させながら、接触部１０Ｃを加圧圧縮して当該接触部１０Ｃの一部を外周側に膨出させる。次に、当該溶接工程時に膨出した膨出部を排除する。これにより、溶接時に発生する溶接欠陥部の多くは、膨出部１０Ｄが生成される際に、当該膨出部１０Ｄを構成する部材と共に外部に流動する。したがって、膨出部１０Ｄが排除されれば、溶接箇所に残存する溶接欠陥が減少する。延いては、皿ばねの耐久性が向上し得る。【選択図】 図４