CIRCUIT BOARD
PROBLEM TO BE SOLVED: To improve insulation performance of a circuit board connected to a connector housing.SOLUTION: A circuit board comprises: a plurality of conductive parts 3 which are arranged on a base material 2 in a width direction W of a circuit board 1; and an insulating covering part 4 wh...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
04.10.2018
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To improve insulation performance of a circuit board connected to a connector housing.SOLUTION: A circuit board comprises: a plurality of conductive parts 3 which are arranged on a base material 2 in a width direction W of a circuit board 1; and an insulating covering part 4 which partially covers the plurality of conductive parts 3. Each of the plurality of conductive parts 3 has a first part 31, a second part 32 and a third part 33. The first part 31 is provided at a position to be housed in a connector housing 6. The second part 32 is covered with the covering part 4. The third part 33 is located between the first part 31 and the second part 32 and not covered with the covering part 4. A wide dimension of the third part 33 along the width direction W is smaller than a width dimension of the first part 31 in the width direction W.SELECTED DRAWING: Figure 3
【課題】コネクタハウジングに接続される回路基板の絶縁性能を向上させる。【解決手段】複数の導電部3は、基材2上において回路基板1の幅方向Wに配列されている。絶縁性の被覆部4は、複数の導電部3の一部を覆っている。複数の導電部3の各々は、第一部分31、第二部分32、および第三部分33を有している。第一部分31は、コネクタハウジング6に収容される位置に設けられている。第二部分32は、被覆部4に覆われている。第三部分33は、第一部分31と第二部分32の間に位置しており、被覆部4に覆われていない。第三部分33の幅方向Wに沿う幅寸法は、同方向に沿う第一部分31の幅寸法よりも小さい。【選択図】図3 |
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Bibliography: | Application Number: JP20170054103 |