PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF

• Main Authors: ADACHI TAKEMA, KITAGAWA KATSUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.10.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To prevent dust from being generated from the inner wall surface of a through hole in a printed wiring board.SOLUTION: A printed wiring board 1 according to an embodiment includes a component accommodating cavity 53 on a second surface 3B of a laminate 3 and a through hole 52 that opens on a first surface 3F and communicates with the component accommodating cavity 53. A conductive coating film 60 is formed on the inner wall surface of the through hole 52. In a manufacturing method of a printed wiring board according to the embodiment, an opening is formed in the laminate 3, and the component accommodating cavity 53 is formed by removing a part of the laminate, and the conductive coating film 60 is formed on the inner wall surface of the through hole formed when the opening communicates with the component accommodating cavity 53 by plating or the like.SELECTED DRAWING: Figure 1 【課題】プリント配線板内の貫通孔の内壁面からの発塵の防止。【解決手段】実施形態のプリント配線板１は、積層体３の第２面３Ｂに部品収容用キャビティ５３と、第１面３Ｆに開口していて部品収容用キャビティ５３に通じる貫通孔５２とを有している。貫通孔５２の内壁面に導電性被膜６０が形成されている。実施形態のプリント配線板の製造方法では、積層体３に開口が形成され、さらに、積層体の一部を除去することにより部品収容用キャビティ５３が形成され、開口が部品収容用キャビティ５３に通じることにより形成される貫通孔の内壁面に導電性被膜６０がめっき法などにより形成される。【選択図】図１