ADDITION REACTION-CURABLE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE

• Main Author: MASHITA TAKUSHI
• Format: Patent
• Language: English; Japanese
• Published: 04.10.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide an addition reaction-curable resin composition which has high gas barrier properties and storage stability and is thus free from deterioration in gas barrier properties even after long-term storage, and to provide an optical semiconductor device in which an optical semiconductor element is sealed with a cured product of the addition reaction-curable resin composition.SOLUTION: The addition reaction-curable resin composition contains: an organopolysiloxane (A) having at least two silicon-bonded alkenyl groups reactive with SiH groups in one molecule; an organohydrogenpolysiloxane (B) having at least two SiH groups in one molecule; an organic cyclic compound (C) having two or more alkenyl groups and having an epoxy group; an organic cyclic compound (D) represented by formula (I); and a curing catalyst (E) necessary for an addition reaction.SELECTED DRAWING: None 【課題】ガスバリア性と貯蔵安定性が高く、このため長期間貯蔵してもガスバリア性が低下することが無い付加反応硬化型樹脂組成物及びこの硬化物で光半導体素子が封止された光半導体装置を提供する。【解決手段】１分子中にＳｉＨ基と反応する珪素結合アルケニル基を少なくとも２個有するとオルガノポリシロキサン（Ａ）と、１分子中に少なくとも２個のＳｉＨ基を有するオルガノ水素ポリシロキサン（Ｂ）と、アルケニル基を２個以上有すると共にエポキシ基を有する有機環状化合物（Ｃ）と、式（Ｉ）で示される有機環状化合物（Ｄ）と、付加反応に必要な硬化触媒（Ｅ）と、を含有することを特徴とする付加反応硬化型樹脂組成物である。【選択図】なし