CHEMICAL DEPOSITION APPARATUS HAVING CONDUCTANCE CONTROL

• Main Authors: JEREMY TUCKER, CHUNGUANG XIA, KARL LEESER, RAMESH CHANDRASEKHARAN
• Format: Patent
• Language: English; Japanese
• Published: 27.09.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide an apparatus for performing chemical deposition such as plasma-enhanced chemical vapor deposition, and a method therefor.SOLUTION: A chemical deposition apparatus having conductance control comprises: a showerhead module 130 having a faceplate 136 and a backing plate 139 and including a plurality of inlets 138 which deliver reactor chemistries to a cavity and exhaust outlets 174 which remove reactor chemistries; a pedestal module 140 configured to support a substrate, which moves vertically to close the cavity between the pedestal module and an outer portion of the faceplate; and at least one conductance control assembly which is in fluid communication with the cavity via the exhaust outlets. The at least one conductance control assembly is selected from one or more of the following: a ball valve assembly, a fluidic valve, magnetically coupled rotary plates, and/or a linear based magnetic system.SELECTED DRAWING: Figure 1A 【課題】プラズマ強化化学蒸着などの化学蒸着を行うための装置および関連方法を提供する。【解決手段】コンダクタンス制御を有する化学蒸着装置であって、フェースプレート１３６およびバッキングプレート１３９を有すると共に、リアクタ化学物質を空洞に供給する複数の流入口１３８と、リアクタ化学物質を除去する排気流出口１７４とを備えたシャワーヘッドモジュール１３０と、基板を支持するよう構成され、台座モジュールと、フェースプレートの外側部分との間の空洞を閉じるように垂直移動する台座モジュール１４０と、排気流出口を介して空洞に流体連通する少なくとも１つのコンダクタンス制御アセンブリとを備える。少なくとも１つのコンダクタンス制御アセンブリは、ボールバルブアセンブリ、流体バルブ、磁気的に結合された回転プレート、および／または、リニアベースの磁気システムの内の１または複数から選択される。【選択図】図１Ａ