CHEMICAL MECHANICAL PLANARIZATION OF FILMS COMPRISING ELEMENTAL SILICON

• Main Authors: JOSEPH ROSE, JAMES MATTHEW HENRY, TAMBOLI DNYANESH CHANDRAKANT, KRISHNA P MURELLA, ZHOU HONGJUN
• Format: Patent
• Language: English; Japanese
• Published: 27.09.2018
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SEMICONDUCTOR DEVICES; SKI WAXES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide chemical mechanical planarization polishing compositions used in production of a semiconductor device, and polishing methods for carrying out chemical mechanical planarization.SOLUTION: Chemical Mechanical Planarization (CMP) polishing compositions comprise abrasive...