COVERLAY FILM AND FLEXIBLE PRINTED CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a film having small dielectric constant and dielectric loss tangent, and their characteristics are developed uniformly without impairing the basic characteristics required for a coverlay film, and can be used in a coverlay for high frequency circuit.SOLUTION: A cover...

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Bibliographic Details
Main Authors TATEISHI KAZUYUKI, SAITO JUMPEI, KONO FUMIYA, TAWADA MAKOTO, FUKUSHIMA NAOKI, HOSOGAI SEIJI
Format Patent
LanguageEnglish
Japanese
Published 20.09.2018
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a film having small dielectric constant and dielectric loss tangent, and their characteristics are developed uniformly without impairing the basic characteristics required for a coverlay film, and can be used in a coverlay for high frequency circuit.SOLUTION: A coverlay film uses polyimide resin having a dielectric constant of 3.3 or less and a dielectric loss tangent of 0.008 or less at 10 GHz, and adhesion strength of 10 N/cm or more.SELECTED DRAWING: None 【課題】カバーレイフィルムに求められる基本的な特性を損なうことなく、誘電率や誘電正接が小さく、それらの特性が均一に発現される、高周波回路用カバーレイに用いることが可能なフィルムを提供すること。【解決手段】１０ＧＨｚにおける誘電率が３．３以下であり、誘電正接が０．００８以下であり、かつ密着強度が１０Ｎ/ｃｍ以上であることを特徴とするポリイミド樹脂を用いたカバーレイフィルムとする。【選択図】なし
Bibliography:Application Number: JP20170042133