COVERLAY FILM AND FLEXIBLE PRINTED CIRCUIT BOARD
PROBLEM TO BE SOLVED: To provide a film having small dielectric constant and dielectric loss tangent, and their characteristics are developed uniformly without impairing the basic characteristics required for a coverlay film, and can be used in a coverlay for high frequency circuit.SOLUTION: A cover...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
20.09.2018
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a film having small dielectric constant and dielectric loss tangent, and their characteristics are developed uniformly without impairing the basic characteristics required for a coverlay film, and can be used in a coverlay for high frequency circuit.SOLUTION: A coverlay film uses polyimide resin having a dielectric constant of 3.3 or less and a dielectric loss tangent of 0.008 or less at 10 GHz, and adhesion strength of 10 N/cm or more.SELECTED DRAWING: None
【課題】カバーレイフィルムに求められる基本的な特性を損なうことなく、誘電率や誘電正接が小さく、それらの特性が均一に発現される、高周波回路用カバーレイに用いることが可能なフィルムを提供すること。【解決手段】10GHzにおける誘電率が3.3以下であり、誘電正接が0.008以下であり、かつ密着強度が10N/cm以上であることを特徴とするポリイミド樹脂を用いたカバーレイフィルムとする。【選択図】なし |
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Bibliography: | Application Number: JP20170042133 |