POWER MODULE

• Main Authors: MURATA DAISUKE, ISHIBASHI HIDETOSHI, YOSHIDA HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 20.09.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a power module for preventing variations in the magnitude of a current flowing through a copper block.SOLUTION: A power module includes: a relay substrate 4 having a first conductor layer 4a and a second conductor layer 4c on the surface and the back face, respectively; a copper block 6 which is inserted into a hole penetrating in the thickness direction of the relay substrate 4 and penetrates through the first conductor layer 4a and the second conductor layer 4b; and a main electrode 11 located in a position opposite to the end surface of the copper block 6. One main electrode 11 includes: a semiconductor element 1a to which only one copper block 6 is electrically connected; an insulating substrate 3 joined to the back face of the semiconductor element 1a via a joint material 2; and a sealing material 9 for sealing the relay substrate 4, the copper block 6 and the semiconductor element 1.SELECTED DRAWING: Figure 1 【課題】銅ブロックに流れる電流の大きさにばらつきが生じることを防止するパワーモジュールを提供する。【解決手段】第１導体層４ａと第２導体層４ｃとを表面と裏面とにそれぞれ有する中継基板４と、中継基板４の厚さ方向に貫通した孔に挿入され、第１導体層４ａと第２導体層４ｂと導通する銅ブロック６と、銅ブロック６の端面に対向した位置に主電極１１を有する。一つの主電極１１には、一つの銅ブロック６のみが電気的に接続された半導体素子１ａと、半導体素子１ａの裏面に接合材２を介して接合された絶縁基板３と、中継基板４、銅ブロック６及び半導体素子１とを封止する封止材９を備える。【選択図】図１