MULTILAYER POLYIMIDE FILM
PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of FPC, can uniformly exhibit those characteristics and can be used for a coverlay for a high frequency circuit.SOLUTION: A multilayer polyimid...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
20.09.2018
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Abstract | PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of FPC, can uniformly exhibit those characteristics and can be used for a coverlay for a high frequency circuit.SOLUTION: A multilayer polyimide film has at least one layer of a non-thermoplastic polyimide resin layer, has a thickness of 25 μm or more and has a transmission loss of 6 dB/10 cm or less at 10 GHz when laminating the multilayer polyimide film and a copper foil at a laminating temperature of 360°C, a laminating pressure of 0.8 ton and a laminating speed of 1 m/min and measuring the transmission loss.SELECTED DRAWING: None
【課題】FPCに求められる基本的な特性を損なうことなく、誘電率や誘電正接が小さく、それらの特性が均一に発現される、高周波回路用カバーレイに用いることが可能なフィルムの提供。【解決手段】少なくとも一層の非熱可塑性ポリイミド樹脂層を有する多層ポリイミドフィルムであって、厚みが25μm以上であり、該多層ポリイミドフィルムと銅箔を、ラミネート温度360℃、ラミネート圧力0.8トン、ラミネート速度1m/minで積層して測定したときの伝送損失が10GHzにおいて、6dB/10cm以下となる多層ポリイミドフィルム。【選択図】なし |
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AbstractList | PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of FPC, can uniformly exhibit those characteristics and can be used for a coverlay for a high frequency circuit.SOLUTION: A multilayer polyimide film has at least one layer of a non-thermoplastic polyimide resin layer, has a thickness of 25 μm or more and has a transmission loss of 6 dB/10 cm or less at 10 GHz when laminating the multilayer polyimide film and a copper foil at a laminating temperature of 360°C, a laminating pressure of 0.8 ton and a laminating speed of 1 m/min and measuring the transmission loss.SELECTED DRAWING: None
【課題】FPCに求められる基本的な特性を損なうことなく、誘電率や誘電正接が小さく、それらの特性が均一に発現される、高周波回路用カバーレイに用いることが可能なフィルムの提供。【解決手段】少なくとも一層の非熱可塑性ポリイミド樹脂層を有する多層ポリイミドフィルムであって、厚みが25μm以上であり、該多層ポリイミドフィルムと銅箔を、ラミネート温度360℃、ラミネート圧力0.8トン、ラミネート速度1m/minで積層して測定したときの伝送損失が10GHzにおいて、6dB/10cm以下となる多層ポリイミドフィルム。【選択図】なし |
Author | SAITO JUMPEI KONO FUMIYA HOSOGAI SEIJI TAWADA MAKOTO TATEISHI KAZUYUKI FUKUSHIMA NAOKI |
Author_xml | – fullname: TATEISHI KAZUYUKI – fullname: SAITO JUMPEI – fullname: KONO FUMIYA – fullname: TAWADA MAKOTO – fullname: FUKUSHIMA NAOKI – fullname: HOSOGAI SEIJI |
BookMark | eNrjYmDJy89L5WSQ9A31CfH0cYx0DVII8PeJ9PT1dHFVcPP08eVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhhaGJqbGBsaOxkQpAgA0LyJE |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 多層ポリイミドフィルム |
ExternalDocumentID | JP2018145303A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JP2018145303A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 16:30:43 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English Japanese |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JP2018145303A3 |
Notes | Application Number: JP20170042132 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180920&DB=EPODOC&CC=JP&NR=2018145303A |
ParticipantIDs | epo_espacenet_JP2018145303A |
PublicationCentury | 2000 |
PublicationDate | 20180920 |
PublicationDateYYYYMMDD | 2018-09-20 |
PublicationDate_xml | – month: 09 year: 2018 text: 20180920 day: 20 |
PublicationDecade | 2010 |
PublicationYear | 2018 |
RelatedCompanies | KANEKA CORP |
RelatedCompanies_xml | – name: KANEKA CORP |
Score | 3.287462 |
Snippet | PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP |
Title | MULTILAYER POLYIMIDE FILM |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180920&DB=EPODOC&locale=&CC=JP&NR=2018145303A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1bS8MwFD7MKeqbTsU5lSLSt2Iv6daXIlsvbKVdy-hkexpJ2oIKOlzFv-9J6HRPe0ty4OQC55qTLwCPlBHK0c_WBszoa6RySo1Sk2qUD9B95xVlhchDJtP-eE6ihb1owfv2LYzECf2R4IgoURzlvZb6ev2fxPJlbeXmib3i0OdzmLu-2kTHAozK1FV_5AZZ6qee6nlulKnTmaQZxEaFPTyAQ-FHC6D94GUknqWsd21KeAZHGbL7qM-h9UY7cOJtv17rwHHS3HhjsxG-zQV0k3mcT-LhMpgpWRovUe34gRJO4uQSHsIg98YazrH629EqynbWY11BG0P98hoUAVbvVKbF7JITOtCZzXXbQReIFIVBLbsLvT2MbvZSe3AqeqLWwdRvoV1_fZd3aFBrdi8P4hfDLHYQ |
link.rule.ids | 230,309,786,891,25594,76903 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1ZS8NAEB5qFeubVqW1HkEkb8E0R5OXIG0OkpiLkkr7FHZzgApabMS_72RJtU99W3Zg9oA5vtmZWYAHQhWSo58taHQ8EZRKLwVCJCKQXEP3Pa8ILZo4ZBhN3IXiL9VlB963tTCsT-gPa46IEpWjvNdMX6__g1gWy63cPNJXnPp8clLD4lt03DSjkkTemhl2EluxyZum4Sd8NGe0saKiwp4ewKGGmJBhpZdZU5ay3rUpzikcJcjuoz6DzhvpQ8_cfr3Wh-OwffHGYSt8m3MYhosg9YLpyp5zSRysUO1YNud4QXgB946dmq6Aa2R_J8r8ZGc_8iV0EeqXA-CaZvV6JclULXOFaCJVc1HV0QVSimJMZHUIoz2MrvZS76DnpmGQBV70PIKThtLkPUjiNXTrr-_yBo1rTW_ZpfwCbNp4-g |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=MULTILAYER+POLYIMIDE+FILM&rft.inventor=TATEISHI+KAZUYUKI&rft.inventor=SAITO+JUMPEI&rft.inventor=KONO+FUMIYA&rft.inventor=TAWADA+MAKOTO&rft.inventor=FUKUSHIMA+NAOKI&rft.inventor=HOSOGAI+SEIJI&rft.date=2018-09-20&rft.externalDBID=A&rft.externalDocID=JP2018145303A |