MULTILAYER POLYIMIDE FILM

• Main Authors: TATEISHI KAZUYUKI, SAITO JUMPEI, KONO FUMIYA, TAWADA MAKOTO, FUKUSHIMA NAOKI, HOSOGAI SEIJI
• Format: Patent
• Language: English; Japanese
• Published: 20.09.2018
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of FPC, can uniformly exhibit those characteristics and can be used for a coverlay for a high frequency circuit.SOLUTION: A multilayer polyimide film has at least one layer of a non-thermoplastic polyimide resin layer, has a thickness of 25 μm or more and has a transmission loss of 6 dB/10 cm or less at 10 GHz when laminating the multilayer polyimide film and a copper foil at a laminating temperature of 360°C, a laminating pressure of 0.8 ton and a laminating speed of 1 m/min and measuring the transmission loss.SELECTED DRAWING: None 【課題】ＦＰＣに求められる基本的な特性を損なうことなく、誘電率や誘電正接が小さく、それらの特性が均一に発現される、高周波回路用カバーレイに用いることが可能なフィルムの提供。【解決手段】少なくとも一層の非熱可塑性ポリイミド樹脂層を有する多層ポリイミドフィルムであって、厚みが２５μｍ以上であり、該多層ポリイミドフィルムと銅箔を、ラミネート温度３６０℃、ラミネート圧力０．８トン、ラミネート速度１ｍ／ｍｉｎで積層して測定したときの伝送損失が１０ＧＨｚにおいて、６ｄＢ／１０ｃｍ以下となる多層ポリイミドフィルム。【選択図】なし