MULTILAYER POLYIMIDE FILM
PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of FPC, can uniformly exhibit those characteristics and can be used for a coverlay for a high frequency circuit.SOLUTION: A multilayer polyimid...
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Main Authors | , , , , , |
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Format | Patent |
Language | English Japanese |
Published |
20.09.2018
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a film that has a small dielectric constant and a small dielectric tangent without impairing basic characteristics required of FPC, can uniformly exhibit those characteristics and can be used for a coverlay for a high frequency circuit.SOLUTION: A multilayer polyimide film has at least one layer of a non-thermoplastic polyimide resin layer, has a thickness of 25 μm or more and has a transmission loss of 6 dB/10 cm or less at 10 GHz when laminating the multilayer polyimide film and a copper foil at a laminating temperature of 360°C, a laminating pressure of 0.8 ton and a laminating speed of 1 m/min and measuring the transmission loss.SELECTED DRAWING: None
【課題】FPCに求められる基本的な特性を損なうことなく、誘電率や誘電正接が小さく、それらの特性が均一に発現される、高周波回路用カバーレイに用いることが可能なフィルムの提供。【解決手段】少なくとも一層の非熱可塑性ポリイミド樹脂層を有する多層ポリイミドフィルムであって、厚みが25μm以上であり、該多層ポリイミドフィルムと銅箔を、ラミネート温度360℃、ラミネート圧力0.8トン、ラミネート速度1m/minで積層して測定したときの伝送損失が10GHzにおいて、6dB/10cm以下となる多層ポリイミドフィルム。【選択図】なし |
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Bibliography: | Application Number: JP20170042132 |