FLEXIBLE CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a flexible circuit board having superior durability against bending and folding, which is arranged so that a break of circuitry and a crack of the board can be prevented.SOLUTION: A flexible circuit board comprises: a polyimide layer having a thickness within a range...

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Bibliographic Details
Main Authors SHIGEMATSU SAKURAKO, NAKABAYASHI TOSHIYUKI, FUJIMOTO NOBUETSU
Format Patent
LanguageEnglish
Japanese
Published 06.09.2018
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Summary:PROBLEM TO BE SOLVED: To provide a flexible circuit board having superior durability against bending and folding, which is arranged so that a break of circuitry and a crack of the board can be prevented.SOLUTION: A flexible circuit board comprises: a polyimide layer having a thickness within a range of 5 to 30 μm and a tensile elasticity within a range of 4 to 10 GPa; and copper interconnections laminated on at least one face of the polyimide layer made of copper foil, and having a thickness within a range of 6 to 20 μm and a tensile elasticity within a range of 25 to 35 GPa. The flexible circuit board has a ten-point average roughness (Rz) within a range of 0.7 to 2.2 μm about the copper foil on the face on a side where the circuit board is in contact with the polyimide layer, and a creasing habit coefficient [PF] within a range of 0.96±0.025, which is calculated according to the formula (1) in a bending test with a gap 0.3 mm. [In the formula (1), |ε| denotes an absolute value of a flexural average strain value of the copper interconnections and εc denotes a tensile elastic limit strain of the copper interconnections].SELECTED DRAWING: None 【課題】配線回路の断線や割れを防止する、優れた耐折り曲げ性を有するフレキシブル回路基板を提供する。【解決手段】フレキシブル回路基板は、厚み5〜30μmの範囲内、引張弾性率4〜10GPaの範囲内のポリイミド層と、ポリイミド層の少なくとも一方の面に積層された厚み6〜20μmの範囲内、引張弾性率25〜35GPaの範囲内の銅箔からなる銅配線と、を有している。フレキシブル回路基板は、ポリイミド層と接する側の面の銅箔の十点平均粗さ(Rz)が0.7〜2.2μmの範囲内であり、かつ、ギャップ0.3mmでの折り曲げ試験での、下記式(1)によって計算される折れ癖係数[PF]が0.96±0.025の範囲にある。[式(1)において、|ε|は銅配線の屈曲平均ひずみ値の絶対値であり、εcは銅配線の引張弾性限界ひずみである。]【選択図】なし
Bibliography:Application Number: JP20180071458