MANUFACTURING METHOD OF OPTICAL DEVICE

• Main Authors: IZAWA SEIJI, FURUTA TORU
• Format: Patent
• Language: English; Japanese
• Published: 06.09.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical device in which openings formed, respectively, in multiple metal layers can be placed easily while superposing.SOLUTION: A manufacturing method of a device 10 includes to prepare a substrate 11 where a first metal layer 13, composed of a first metal material, is formed on both sides of a first insulation layer 12, to form multiple sets of first openings 13A, overlapping each other, on the first metal layers 13 on the front and back, to form a second insulation layer 22 and a second meta layer 23, composed of a second metal material, on both sides of the substrate 11, to form multiple second openings 23A of the same diameter or a larger diameter than the first opening 13A and superposing the first opening 13A in the second meta layer 23, to form a through hole 16 penetrating the substrate 11 and the second insulation layer 22 by laser irradiation using the second meta layer 23 as a mask, and to remove the first metal layers 13 exposed to the inner face of the through hole 16 by etching for removing first metal material selectively.SELECTED DRAWING: Figure 1 【課題】複数の金属層のそれぞれに形成された開口を重ねて配置し易い光学デバイスの製造方法の提供を目的とする。【解決手段】本発明のデバイス１０の製造方法は、第１絶縁層１２の両面に第１金属材料からなる第１金属層１３が形成された基板１１を準備することと、表裏の第１金属層１３に、互いに重なる第１開口１３Ａの組を複数組形成することと、基板１１の両面に、第２絶縁層２２と第２金属材料からなる第２金属層２３を形成することと、第２金属層２３に、第１開口１３Ａと重なり且つ第１開口１３Ａと同径又は第１開口１３Ａより大径の第２開口２３Ａを複数形成することと、第２金属層２３をマスクに用いてレーザーを照射して、基板１１と第２絶縁層２２を貫通する貫通孔１６を形成することと、第１金属材料を選択的に除去するエッチングにより貫通孔１６の内面に露出する第１金属層１３を除去することと、を含む。【選択図】図１