CONDUCTIVE SUBSTRATE, METHOD FOR PRODUCING CONDUCTIVE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a conductive substrate capable of suppressing peeling off of a blackened layer.SOLUTION: A conductive substrate 10A includes a transparent base 11, a metal layer 12 formed on a first principal plane 11a side of the transparent base 11, a protective layer 13 formed on...

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Main Authors HATA HIROKI, SHIGA DAIKI, YEH TSUNG-HER, HU CHIN-MING, ARIMA HIRONOBU, NISHIYAMA YOSHIHIDE, SUDA TAKAHIRO, YEH YUOU
Format Patent
LanguageEnglish
Japanese
Published 06.09.2018
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Summary:PROBLEM TO BE SOLVED: To provide a conductive substrate capable of suppressing peeling off of a blackened layer.SOLUTION: A conductive substrate 10A includes a transparent base 11, a metal layer 12 formed on a first principal plane 11a side of the transparent base 11, a protective layer 13 formed on the metal layer 12 and containing an organic compound containing sulfur atoms and/or nitrogen atoms, and a blackened layer 14 formed on the protective layer 13.SELECTED DRAWING: Figure 2 【課題】黒化層が剥離することを抑制した導電性基板を提供する。【解決手段】導電性基板10Aは、透明基材11と、透明基材11の第1の主平面11a側に形成された金属層12と、金属層12上に形成され、硫黄原子および/または窒素原子を含む有機化合物を含有する保護層13と、保護層13上に形成された黒化層14と、を有する。【選択図】図2
Bibliography:Application Number: JP20150152891