FILM FOR PACKING MATERIAL, PACKING MATERIAL AND PACKAGE

PROBLEM TO BE SOLVED: To provide a film for packing material with good property of low temperature heat seal while having good slippage and blocking resistance during processing without addition of anti-blocking agent or lubricant, and a packing material using the film for packing material and a pac...

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Bibliographic Details
Main Author SAKIYAMA TETSUZO
Format Patent
LanguageEnglish
Japanese
Published 30.08.2018
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Summary:PROBLEM TO BE SOLVED: To provide a film for packing material with good property of low temperature heat seal while having good slippage and blocking resistance during processing without addition of anti-blocking agent or lubricant, and a packing material using the film for packing material and a package.SOLUTION: A film for packing material 5 has a sealant film 3 (the first layer 3) with thermoplastic resin as main resin, and a first uneven shape 1 formed all over the surface of the sealant film 3 and a second uneven shape 2, formed on the first uneven shape 1, whose average roughness is smaller than the first uneven shape 1. The surface of said sealant film 3 has an arithmetic average roughness Ra between 0.5 μm and 2.0 μm and its ten-point average roughness Rz is between 4.0 μm and 12.0 μm.SELECTED DRAWING: Figure 1 【課題】アンチブロッキング剤や滑剤を入れることなく、加工工程での良好な滑り性、耐ブロッキング性を有するとともに、低温ヒートシール性が良好である包装材用フィルム、および包装材用フィルムを用いた包装材、包装体を提供する。【解決手段】包装材用フィルム5は、熱可塑性樹脂を主樹脂としたシーラントフィルム3(第一層3)を有し、シーラントフィルム3の表面全面に形成された第1の凹凸形状1と、第1の凹凸形状1の上に形成され且つ第1の凹凸形状1よりも平均粗さが小さな第2の凹凸形状2と、を備え、前記シーラントフィルム3の表面は、算術平均粗さRaが0.5μm以上2.0μm以下であり、十点平均粗さRzが4.0μm以上12.0μm以下である。【選択図】図1
Bibliography:Application Number: JP20170032031