SOLDER ALLOY FOR LED AND LED MODULE

• Main Authors: FUJIMAKI REI, SAKAMOTO KENJI, UEJIMA MINORU
• Format: Patent
• Language: English; Japanese
• Published: 30.08.2018
• Subjects: ALLOYS; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; FERROUS OR NON-FERROUS ALLOYS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a solder alloy with a composition suitable in soldering a module in which an undersurface of a component of which a body not substantially having an electrode at the lateral face thereof is made of ceramic is jointed to a metal substrate by welding.SOLUTION: A solder alloy used for a module in which an undersurface of a component of which a body not substantially having an electrode at the lateral face thereof is made of ceramic is jointed to a metal substrate by welding includes, by mass, 0-3% Ag, 0.3-1.2% Cu, 3-10% Sb and the balance Sn.SELECTED DRAWING: None 【課題】側面に電極を実質的に有していない本体がセラミックから成る部品の下面と金属基板とをはんだ接合したモジュールをはんだ付けする際に適した組成のはんだ合金の提供。【解決手段】側面に電極を実質的に有していない本体がセラミックから成る部品の下面と金属基板とをはんだ接合したモジュールに用いるはんだ合金であって、質量％で、Ａｇ：０〜３％、Ｃｕ：０．３〜１．２％、Ｓｂ：３〜１０％、残部Ｓｎからなるはんだ合金。【選択図】なし