RETAINING METHOD FOR WAFER

PROBLEM TO BE SOLVED: To achieve prevention of tape burning by suppressing generation of bubbles between a tape and a retaining surface.SOLUTION: The retaining method for wafer, retaining a wafer (W) with a tape (T) adhering to its undersurface on a retaining surface (41) of an electrostatic chuck (...

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Bibliographic Details
Main Author IIDA HIDEKAZU
Format Patent
LanguageEnglish
Japanese
Published 23.08.2018
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To achieve prevention of tape burning by suppressing generation of bubbles between a tape and a retaining surface.SOLUTION: The retaining method for wafer, retaining a wafer (W) with a tape (T) adhering to its undersurface on a retaining surface (41) of an electrostatic chuck (4), includes: an uneven surface formation process for forming innumerable uneven portions (D) on an undersurface of the tape; an attraction retaining process for attracting a clearance formed between the uneven portion and the retaining surface and attracting and retaining the tape; and an electrostatic force retaining process for attracting and retaining the tape by an electrostatic force generated on the retaining surface.SELECTED DRAWING: Figure 3 【課題】テープと保持面との間に気泡が発生するのを抑制し、テープ焼けを防止すること。【解決手段】下面にテープ（Ｔ）が貼着されたウエーハ（Ｗ）を静電チャック（４）の保持面（４１）で保持するウエーハの保持方法であって、テープの下面に無数の凹凸（Ｄ）を形成する凹凸面形成工程と、凹凸と保持面との間に形成される隙間を吸引してテープを吸引保持する吸引保持工程と、保持面上に発生する静電力でテープを吸着保持する静電力保持工程と、を備える。【選択図】図３
Bibliography:Application Number: JP20170027476