RESIN COMPOSITION COMPRISING CONDUCTIVE PARTICLES

• Main Authors: KISHI ARATA, HINO HIROHISA, SUZUKI YASUHIRO, YOSHIOKA YUKI
• Format: Patent
• Language: English; Japanese
• Published: 23.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; INSULATORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a resin composition capable of forming an adhesion part which can be hardened even at a low temperature and has sufficient conductivity and connection reliability.SOLUTION: There is provided a resin composition which comprises conductive particles, an epoxy resin, a phenoxy resin and a curing agent and comprises solder particles as the conductive particles, wherein the epoxy resin is one or more selected from a bisphenol type epoxy resin, a phenol novolac type epoxy resin, a biphenyl type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene type epoxy resin, a triglycidyl isocyanurate, a cyclohexane type epoxy resin and an adamantane type epoxy resin and the curing agent is one or more compounds selected from the group consisting of an epoxy resin amine adduct compound, an epoxy resin imidazole adduct compound and a modified aliphatic polyamine compound.SELECTED DRAWING: Figure 1 【課題】本発明は、低温でも硬化することができ、十分な導電性と、接続信頼性とを有する接着部を形成することのできる樹脂組成物を提供することを目的とする。【解決手段】導電性粒子とエポキシ樹脂とフェノキシ樹脂と硬化剤とを含む樹脂組成物であって、前記導電性粒子としてハンダ粒子を含み、前記エポキシ樹脂はビスフェノール型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリグリシジルイソシアヌレート、シクロヘキサン型エポキシ樹脂、アダマンタン型エポキシ樹脂から選択される１種以上のエポキシ樹脂であり、前記硬化剤が、エポキシ樹脂アミンアダクト化合物、エポキシ樹脂イミダゾールアダクト化合物、変性脂肪族ポリアミン化合物からなる群から選択される１種類以上の化合物である、樹脂組成物。【選択図】図１