SUBSTRATE PROCESSING METHOD

• Main Authors: KARL HEINZ PRIEWASSER, HATTORI NAO, MORIKAZU HIROSHI
• Format: Patent
• Language: English; Japanese
• Published: 16.08.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a method of processing a substrate which allows for the substrate to be processed in an accurate, reliable and efficient manner.SOLUTION: In a method of processing a substrate 2 having a first surface 2a with at least one division line 22 formed thereon and a second surface 2b opposite the first surface, a pulsed laser beam is applied to the substrate from the side of the first surface. The substrate is made of a material which is transparent to the pulsed laser beam. The pulsed laser beam is applied to the substrate at least in a plurality of positions along the at least one division line 22, in a condition where a focal point of the pulsed laser beam is located at a distance from the first surface in the direction from the first surface toward the second surface, so as to form a plurality of modified regions 23 inside the substrate 2. Each modified region is arranged entirely within the bulk of the substrate, without forming any openings open to the first surface or the second surface. A substrate material is removed along the at least one division line where the modified regions arranged entirely within the bulk of the substrate are present.SELECTED DRAWING: Figure 7 【課題】正確、かつ、確実であり効率的な仕方で基板を加工できる基板加工方法を提供する。【解決手段】分割線２２が形成された第１面２ａと、第１面とは反対の第２面２ｂと、を有する基板２を加工する方法において、第１面側から基板にパルスレーザビームを照射する。基板は、パルスレーザビームに対して透明な材料で作られている。パルスレーザビームは、基板２の内部に複数の改質領域２３を形成するように、パルスレーザビームの焦点位置が第１面から第２面に向かう方向において第１面から離れて配置された状態で、少なくとも１つの分割線２２に沿った少なくとも複数の位置で基板に照射される。各改質領域が、第１面または第２面に開口する開口部を形成することなく、完全に基板のバルク内部に配置され、完全に基板のバルク内部に配置された改質領域が存在する少なくとも１つの分割線に沿って基板材料を除去する。【選択図】図７