METHOD FOR PRODUCING MULTILAYERED POLYIMIDE FILM

• Main Authors: TATEISHI KAZUYUKI, KONO FUMIYA, TAWADA MAKOTO, SHIMIZU MASAYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 16.08.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method for producing a multilayered polyimide film having low transmission loss which can be suitably used for a high frequency circuit board with high yield.SOLUTION: There is provided a method for producing a multilayered polyimide film 4 in which non-thermoplastic polyimide layers 21 and 22 having a dielectric tangent of 0.001 to 0.009 at 10 GHz are laminated on at least one surface of a non-thermoplastic polyimide film 1 and a thermoplastic polyimide layer 23 is further laminated, wherein the occurrence of winding deviation or the like is suppressed by c, e and g production methods in which the thickness of a layer forming end part in the width direction of the film after the polyimide layer formation b, d and f is made thinner than the film central part.SELECTED DRAWING: Figure 3 【課題】高周波回路基板に好適に使用することができる低伝送損失の多層ポリイミドフィルムを歩留まりよく製造する方法の提供。【解決手段】非熱可塑性ポリイミドフィルム１の少なくとも片面に、１０ＧＨｚにおける誘電正接が０．００１〜０．００９である非熱可塑性ポリイミド層２１，２２を積層し、さらに熱可塑性ポリイミド層２３を積層する多層ポリイミドフィルム４の製造方法において、前記ポリイミド層形成ｂ，ｄ，ｆ後のフィルムの幅方向の層形成端部の厚みをフィルム中央部よりも薄くするｃ，ｅ，ｇ製造方法により、巻ズレ等の発生を抑止する、多層ポリイミドフィルムの製造方法。【選択図】図３