METHOD FOR PRODUCING MULTILAYERED POLYIMIDE FILM

• Main Authors: TATEISHI KAZUYUKI, KONO FUMIYA, TAWADA MAKOTO, SHIMIZU MASAYOSHI, BANYA SHOTO
• Format: Patent
• Language: English; Japanese
• Published: 16.08.2018
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method for producing a multilayered polyimide film which can be suitably used for a high frequency circuit board capable of reducing transmission loss.SOLUTION: There is provided a method for producing a multilayered polyimide film 4 in which a non-thermoplastic polyimide layer 2 having a dielectric tangent of 0.001 to 0.009 at 10 GHz is laminated on at least one surface of a non-thermoplastic polyimide film 1 and a thermoplastic polyimide layer 3 is further laminated, heat treatment is carried out so that the residual amount of volatile substances is 8 to 18 wt.% to obtain a prefilm, followed by subjecting the prefilm to heat treatment.SELECTED DRAWING: Figure 1 【課題】伝送損失の低減が可能な高周波回路基板に好適に使用することができる多層ポリイミドフィルムの製造方法の提供。【解決手段】非熱可塑性ポリイミドフィルム１の少なくとも片面に、１０ＧＨｚにおける誘電正接が０．００１〜０．００９である非熱可塑性ポリイミド層２を積層し、さらに熱可塑性ポリイミド層３を積層し、残揮発物量が８重量％〜１８重量％となるように加熱処理を行いプレフィルムを得、プレフィルムにさらに加熱処理を行い、多層ポリイミドフィルム４を得る製造方法。【選択図】図１