ACTIVE MATRIX SUBSTRATE

• Main Authors: TAKEYA JUNICHI, MOTSUMURO TOMOKI
• Format: Patent
• Language: English; Japanese
• Published: 09.08.2018
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; LABELS OR NAME-PLATES; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

PROBLEM TO BE SOLVED: To solve the problems that a large-scaled initial investment is required because a manufacturing device capable of handling a large-sized substrate has to be introduced to manufacture a large area active matrix substrate, that cost increases due to a time required for a mounting process, a deterioration in a mounting yield or the like because of a drastic increase in a mounting place and high positional accuracy required in mounting as well as resolution improvement of an active matrix even though a method for transferring and mounting a transistor circuit board created by a different board by suppressing an initial investment is provided, and that a flexible substrate is currently required to be transferred with high accuracy.SOLUTION: A rotary transfer device continuously transfers a circuit board formed on a rectangular flexible substrate whose aspect ratio is 1: 1 or above to a prescribed place on a large-sized substrate. Especially, when circuit boards are connected into strip shapes, the number of transferring times is greatly reduced and a flexible substrate can be transferred with high accuracy.SELECTED DRAWING: Figure 1 【課題】 大面積アクティブマトリクス基板を作製するには、大型基板を扱える製造装置を導入しなければならず、大掛かりな初期投資が必要となる。また、初期投資を抑え別基板で作成したトランジスタ回路基板を大型基板へ転写・実装する方法も提唱されているが、アクティブマトリクスの解像度向上と共に実装箇所の大幅な増加や実装に求められる位置精度などが高くなり、実装工程に要する時間や実装歩留まり低下などによるコストアップが問題となっている。更に現在、可撓性基板を高精度に転写することが求められている。【解決手段】アスペクト比が１：１以上の長方形をしたフレキシブル基板上に形成された回路基板を輪転式転写装置にて連続的に大型基板上の所定の箇所へ転写していく。特に、回路基板を短冊状に繋げておけば、転写回数を大幅に減らし精度良く可撓性基板を転写すことができる。【選択図】図１