ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME

• Main Authors: MORIYA TOSHIMITSU, IZAWA HIROYUKI, DAITO YUMIKO
• Format: Patent
• Language: English; Japanese
• Published: 02.08.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive composition that turns into a cured product with excellent physical properties (particularly, elastic moduli) even when cured at low temperature and in a short time.SOLUTION: An adhesive composition contains a thiol compound having two or more mercapto groups, an allyl compound having an allyl group, and a photopolymerization initiator. In the total of the amount of substance of mercapto groups and the amount of substance of allyl groups in the adhesive composition, the ratio of the amount of substance of mercapto groups is 40% or less.SELECTED DRAWING: None 【課題】低温かつ短時間で硬化した場合でも硬化物の物性（特に弾性率）に優れる接着剤組成物を提供すること。【解決手段】２つ以上のメルカプト基を有するチオール化合物と、アリル基を有するアリル化合物と、光重合開始剤と、を含有する接着剤組成物であって、接着剤組成物中のメルカプト基の物質量とアリル基の物質量との合計に占めるメルカプト基の物質量の割合が４０％以下である、接着剤組成物。【選択図】なし