LAMINATE

PROBLEM TO BE SOLVED: To provide a laminate in which an adhesive layer is formed on a heat resistant resin film, where the adhesive layer of the laminate can be bonded to an adherend by short-time thermal compression bonding, is excellent in adhesion with the adherend, and prevents lowering the adhe...

Full description

Saved in:
Bibliographic Details
Main Authors OKUMURA NOBUYASU, SHIMOMURA MIDORI
Format Patent
LanguageEnglish
Japanese
Published 02.08.2018
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a laminate in which an adhesive layer is formed on a heat resistant resin film, where the adhesive layer of the laminate can be bonded to an adherend by short-time thermal compression bonding, is excellent in adhesion with the adherend, and prevents lowering the adhesion even at high temperature.SOLUTION: A laminate has an adhesive layer provided on at least one surface of a resin film, where a resin constituting the resin film is semi-aromatic polyamide and/or a polyimide-based resin, and the adhesive layer contains a dimer acid-based polyamide resin having an amine value of less than 1.0 mgKOH/g and a crosslinking agent.SELECTED DRAWING: None 【課題】耐熱性樹脂フィルム上に接着層を形成してなる積層体であって、この積層体の接着層は、短時間の熱圧着で被着体と接着することができ、被着体との接着性に優れ、高温時においても前記接着性が低下しない積層体を提供する。【解決手段】樹脂フィルムの少なくとも片面に接着層が設けられた積層体であり、樹脂フィルムを構成する樹脂が、半芳香族ポリアミドおよび/またはポリイミド系樹脂であって、接着層が、アミン価が1.0mgKOH/g未満であるダイマー酸系ポリアミド樹脂と、架橋剤とを含有することを特徴とする積層体。【選択図】なし
Bibliography:Application Number: JP20180029269