IMPROVED FORMULATIONS FOR CHEMICAL MECHANICAL POLISHING PADS AND CMP PADS MADE THEREWITH

• Main Authors: BRYAN E BARTON, MICHAEL E MILLS
• Format: Patent
• Language: English; Japanese
• Published: 19.07.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a two-component composition for making chemical mechanical polishing pad for polishing a semiconductor substrate.SOLUTION: A composition comprises: a liquid aromatic isocyanate component (having an unreacted isocyanate (NCO) concentration of from 15 to 40 wt.%, based on the total solids weight of the aromatic isocyanate component) such as methylene di(phenylisocyanate) (MDI); a liquid polyol component of a polyol having a polyether backbone and having from 5 to 7 hydroxyl groups per molecule; and a curative of one or more polyamine or diamine, wherein the reaction mixture comprises 50 to 65 wt.% of hard segment materials, based on the total weight of the reaction mixture. The composition, when mixed, cures to form a polyurethane reaction product. Also provided are CMP polishing pads made from the polyurethane reaction product by spraying the composition into a mold.SELECTED DRAWING: None 【課題】半導体基板を研磨するための化学的機械的研磨パッドを製造するための二成分組成物。【解決手段】メチレンジ（フェニルイソシアネート）（ＭＤＩ）のような液体芳香族イソシアネート成分（芳香族イソシアネート成分の全固形分重量に基づいて１５〜４０重量％の未反応イソシアネート（ＮＣＯ）濃度を有する）、ポリエーテル基本骨格を有し、そして１分子当たり５〜７個のヒドロキシル基を有するポリオールである液体ポリオール成分、及び１種以上のポリアミン又はジアミンである硬化剤を含み、その反応混合物は、反応混合物の全重量に基づいて５０〜６５重量％のハードセグメント材料を含む、組成物。この組成物は、混合されると硬化してポリウレタン反応生成物を形成する。また、組成物を鋳型にスプレーすることにより、ポリウレタン反応生成物から製造されるＣＭＰ研磨パッド。【選択図】なし